Reducing of Vibrations of Wiring Boards in Products of Electronics


This paper on "Reducing of Vibrations of Wiring Boards in Products of Electronics" was presented at the NAFEMS World Congress on The Evolution of Product Simulation From Established Methods to Virtual Testing & Prototyping - 24-28 April 2001, The Grand Hotel, Lake Como, Italy.

Summary

The paper cites the results of the study of vibration protection of the functional boards by means of the damping elements of the attaching structures. The estimate of the value of "dry" friction of the damping element for effective protection is given. A method of attaching of the wiring boards which practically excludes their strains and ensures good vibration isolation in the wide range of driving frequencies has been found.

Document Details

Reference

NWC01_80

Authors

Royzman. V

Language

English

Type

Paper

Date

2001-04-24

Organisations

Technological University of Podillia

Region

Global

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